Glass encapsulation refers to the process of sealing an object or material inside a glass enclosure or capsule. This process is commonly used in the manufacturing of electronic components, such as semiconductors, LEDs, and sensors, to protect them from environmental factors like moisture, dust, and temperature fluctuations.
The encapsulation process typically involves placing the electronic component or material in a mold, and then injecting a liquid glass material into the mold to completely cover and encase the object. The glass is then heated to a high temperature to harden and fuse it together, creating a hermetic seal around the encapsulated object.
The benefits of glass encapsulation include improved durability and longevity of electronic components, as well as increased resistance to environmental factors. Additionally, glass is a highly transparent material, which allows for the transmission of light and signals through the encapsulation, making it suitable for applications like optical sensors and displays.
